Title:
エポキシ樹脂組成物、その成形硬化物、半導体封止材料および電子回路基板用樹脂組成物
Document Type and Number:
Japanese Patent JP4186153
Kind Code:
B2
Inventors:
Ichiro Ogura
Koji Miwa
Koji Miwa
Application Number:
JP2002248640A
Publication Date:
November 26, 2008
Filing Date:
August 28, 2002
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08G59/24; H01L23/29; H01L23/31
Domestic Patent References:
| JP11255867A | ||||
| JP2003252953A | ||||
| JP2002105169A | ||||
| JP6298902A |
Attorney, Agent or Firm:
Kono Tsuyo