Title:
半導体装置
Document Type and Number:
Japanese Patent JP4203501
Kind Code:
B2
Inventors:
Koji Kinomura
Application Number:
JP2005288176A
Publication Date:
January 07, 2009
Filing Date:
September 30, 2005
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/10; H01L23/04; H01L23/08
Domestic Patent References:
| JP7202475A | ||||
| JP7099420A | ||||
| JP10163795A | ||||
| JP5299526A |