Title:
電子線装置による半導体ウェハの検査方法
Document Type and Number:
Japanese Patent JP4204458
Kind Code:
B2
Abstract:
To provide a charged particle beam apparatus capable of estimating measurement completion times.
When a processing time is computed by the addition of a semiconductor wafer transfer time, a stage movement time, a focusing time, a pattern recognition time, etc., the shortest estimated processing time and the longest estimated processing time are computed and displayed by setting a minimum value and a maximum value of the number of retries on focusing and a minimum value and a maximum value of the number of peripheral retrievals of pattern recognition on the focusing time and the pattern recognition time including indeterminate times.
COPYRIGHT: (C)2005,JPO&NCIPI
Inventors:
Enomoto Yuji
Manabu Yano
Eiichi Masuko
Manabu Yano
Eiichi Masuko
Application Number:
JP2003435044A
Publication Date:
January 07, 2009
Filing Date:
December 26, 2003
Export Citation:
Assignee:
Hitachi High-Tech Science Systems Co., Ltd.
International Classes:
G01B15/00; G01B15/04; G01N23/225; H01J37/20; H01J37/21; H01J37/28; H01L21/66
Domestic Patent References:
| JP2003044114A | ||||
| JP2002366222A | ||||
| JP2000161948A | ||||
| JP11248445A | ||||
| JP5107051A |
Attorney, Agent or Firm:
Yusuke Hiraki
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