Title:
耐熱感光性樹脂組成物、レリーフパターンの製造方法及び電子部品
Document Type and Number:
Japanese Patent JP4207581
Kind Code:
B2
Abstract:
A photosensitive resin composition is disclosed that includes (A) a heat-resistant polymer of the general formula (1): (where the symbols are as defined in the specification), (B) a photoreactive compound, and (C) a solvent. A relief pattern is formed from the composition by applying the composition to a support substrate and drying it to form a photosensitive resin film; exposing the dried film; developing the exposed film using an alkaline aqueous solution; and heating the developed photosensitive resin film. Also disclosed is an electronic component that includes an electronic device having such a pattern.
Inventors:
Hiroshi Komatsu
Application Number:
JP2003011888A
Publication Date:
January 14, 2009
Filing Date:
January 21, 2003
Export Citation:
Assignee:
Hitachi Chemical DuPont Micro Systems Co., Ltd.
International Classes:
G03F7/023; G03F7/037; C08K5/00; C08L79/04; G03F7/022; G03F7/40; H01L21/027; H05K1/00
Domestic Patent References:
| JP7128846A | ||||
| JP2001329061A | ||||
| JP2001235860A | ||||
| JP3204649A | ||||
| JP2002278051A |
Attorney, Agent or Firm:
Hiroaki Sakai