Title:
光硬化性樹脂組成物および硬化物
Document Type and Number:
Japanese Patent JP4212076
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a photocurable resin composition having high adhesivity to a copper-clad copper wire useful as a tension member for an optical fiber unit. SOLUTION: This composition comprises (A) a urethane (meth)acrylate obtained by reacting a polyol compound with a polyisocyanate compound and a hydroxyl group-containing (meth)acrylate compound, (B) a compound containing at least one mercapto group and at least one group of the formula -SiRaRbRc (Ra, Rb and Rc are each independently an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a halogen atom or a hydrogen atom) in one molecule, (C) a photopolymerization initiator, (D) an ethylenically unsaturated monomer containing at least one amino group in one molecule and (E) at least one kind of compound selected from the group consisting of (meth) acrylate compounds containing at least one (meth)acryloyl group in one molecule except the component A and the component D.
Inventors:
Masahito Mase
All Komiya
Takashi Ukachi
All Komiya
Takashi Ukachi
Application Number:
JP29218599A
Publication Date:
January 21, 2009
Filing Date:
October 14, 1999
Export Citation:
Assignee:
JSR CORPORATION
DSM IP ASSETS B.V.
DSM IP ASSETS B.V.
International Classes:
G02B6/44; C08F2/48; C08F226/02; C08F290/00; C08F290/06; C08L75/14
Domestic Patent References:
| JP63130608A | ||||
| JP63215707A | ||||
| JP10170775A | ||||
| JP61272228A | ||||
| JP58019354A | ||||
| JP10148740A | ||||
| JP61068215U |
Attorney, Agent or Firm:
Masataka Oshima
Alga Patent Office, a patent business corporation
Alga Patent Office, a patent business corporation