Title:
超音波ボンディング用アルミニウムリボン
Document Type and Number:
Japanese Patent JP4212641
Kind Code:
B1
Abstract:
To provide a bonding ribbon which can be realized the stable bonding strength, which has a homogeneous whole bonded surface every time for several ten thousands bonding cycles. An aluminum ribbon for ultrasonic bonding comprising: an aluminum alloy is more than 99 wt % of Al, it contains additive elements and residual aluminum, wherein it has ultra thin tape structure roll rolled after multi stages drawing, wherein the average crystal grain size at a cross section of the ribbon is 5 - 200 µm, wherein it is featured the ratio of the thickness to the width is 1/2 - 1/20. It is preferable that the aspect ratio of crystal grain (width direction/thickness direction) is 0.5 - 10 and the surface of the tape is mirror-finished wherein the surface roughness R z is less than 2 µm and/or equals to 2 µm.
Inventors:
Mikami Michitaka
Kikuchi Teruo
Yuichi Hirata
Shinichiro Nakajima
Matsumi Sato
Keisuke Kimura
Kikuchi Teruo
Yuichi Hirata
Shinichiro Nakajima
Matsumi Sato
Keisuke Kimura
Application Number:
JP2008201994A
Publication Date:
January 21, 2009
Filing Date:
August 05, 2008
Export Citation:
Assignee:
Tanaka Electronics Co., Ltd.
International Classes:
H01L21/60
Domestic Patent References:
| JP8008288A | ||||
| JP2007335782A | ||||
| JP2004336043A | ||||
| JP2007194270A | ||||
| JP6302639A | ||||
| JP7302811A |
Attorney, Agent or Firm:
Naotaka Kono
Kanji Arai
Eiichiro Shimazaki
Akiko Ishii
Kanji Arai
Eiichiro Shimazaki
Akiko Ishii