Title:
製造検査解析システム、および製造検査解析方法
Document Type and Number:
Japanese Patent JP4216263
Kind Code:
B2
Abstract:
A position change section of a processing device changes the position of a treatment object, at the time of performing a process by a process section, to correspond to a predetermined position in conformity to the treatment object. An inspection device inspects the occurrence of a defect on the treatment object having been subjected to processes by a plurality of processing devices. Then an analyzing process for specifying in which processing device the defect occurred is carried out based on (i) positional information of the treatment object, in each of the processing devices, and (ii) defect information defected by the inspection device. With this arrangement, during the process of manufacture of treatment objects, it is possible to precisely specify which processing device or processing device group caused the defect, without performing processes such as attaching, to the treatment object, information regarding processing devices which have conducted processes.
Inventors:
Nobuyuki Onami
Yu Tanaka
Takeshi Umemoto
Yu Tanaka
Takeshi Umemoto
Application Number:
JP2005066336A
Publication Date:
January 28, 2009
Filing Date:
March 09, 2005
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/66; H01L21/02
Domestic Patent References:
| JP2005057029A | ||||
| JP2004304133A | ||||
| JP2004165570A | ||||
| JP2004071671A | ||||
| JP2003166945A | ||||
| JP2002202204A |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office