Title:
半導体部品接着剤
Document Type and Number:
Japanese Patent JP4216346
Kind Code:
B2
Abstract:
An adhesive for semiconductor parts, comprising, as a base polymer, at least one cyclic structure-containing thermoplastic polymer selected from the group consisting of (a) a cycloolefin polymer and (b) an aromatic-condensed polymer having a repeating unit of an aromatic ring in its main chain, and having a number average molecular weight of 1,000 to 500,000, an adhesive sheet formed of the adhesive, a semiconductor part package making use of the adhesive, and a production process of the package.
Inventors:
Junji Koidemura
Application Number:
JP50688799A
Publication Date:
January 28, 2009
Filing Date:
July 06, 1998
Export Citation:
Assignee:
Zeon Corporation
International Classes:
C09J123/26; C09J9/02; C09J165/00; C09J167/02; C09J171/12; H01B1/20; H01B1/22; H01B1/24; H01L21/60; H05K3/32
Domestic Patent References:
| JP9501197A | ||||
| JP62013473A | ||||
| JP8235931A | ||||
| JP8148251A | ||||
| JP8020692A | ||||
| JP62027412A | ||||
| JP11269255A |
Attorney, Agent or Firm:
Shigeaki Nishikawa