Title:
熱処理炉内の半導体ウェーハの表面温度測定方法およびこの方法に用いられる温度モニタウェーハ
Document Type and Number:
Japanese Patent JP4229273
Kind Code:
B2
Inventors:
Toshiaki Hayashida
Application Number:
JP2003284954A
Publication Date:
February 25, 2009
Filing Date:
August 01, 2003
Export Citation:
Assignee:
sumco tech xiv Co., Ltd.
International Classes:
H01L21/205; H01L21/02
Domestic Patent References:
| JP1181436A | ||||
| JP52098469A | ||||
| JP3091239A | ||||
| JP63017539A | ||||
| JP200439776A |
Attorney, Agent or Firm:
Takahisa Kimura
Yoshiyuki Obata
Yoshiyuki Obata