回路パターン検査方法 - Hitachi High-Technologies Corporation

Title:

回路パターン検査方法

Document Type and Number:

Japanese Patent JP4230899

Kind Code:

B2

Abstract:

To provide an inspection method of a circuit pattern and its device capable of rapidly processing an image of a circuit pattern as an inspection object on the basis of the accurate information of a monitor screen upon inspecting the image of the circuit pattern through the monitor screen, and capable of rapidly detecting defects over an entire product or defects in a specific region.

The inspection method of the circuit pattern detects any defect on the circuit pattern from an inspection image obtained on the basis of a signal generated from the substrate by the irradiation of electromagnetic waves or charged particle rays on a substrate surface on which the circuit pattern of a wafer is formed. In the method, at least before or after the inspection image is obtained, an electron beam is irradiated on a corresponding part of the inspection image to change the charged state of the wafer.

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Inventors:

Yasuhiko Nara
Masaaki Nojiri
Koichi Hayakawa

Application Number:

JP2003415866A

Publication Date:

February 25, 2009

Filing Date:

December 15, 2003

Export Citation:

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Assignee:

Hitachi High-Technologies Corporation

International Classes:

G01N23/225; H01J37/28; H01L21/66

Domestic Patent References:

JP2002289128A
JP2003151483A
JP2003297278A

Attorney, Agent or Firm:

Yukihiko Takada

Previous Patent: 電子写真感光体、電子写真感光体の製造方法、および画像形成装置

Next Patent: IRRADIATION DEVICE OF SYNCHROTRON RADIATION AND X-RAY ALIGNER