Title:
はんだ粉末とその製造方法、およびソルダーペースト
Document Type and Number:
Japanese Patent JP4231157
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lead free solder powder and a solder paste excellent in practical use, wherein even the solder contains high reactive Zn together with Sn, but the solderability is good and the reaction between the active component and the alloy component in the blux is restrained. SOLUTION: Organic acid salt such as stearic copper etc., is stuck to the surface of the solder powder containing Sn, Zn, further Bi, etc., further, in the flux, nonionic surface active agent is added at 0.5-10 wt.%. The organic acid salt can be produced by blasting solution saturated with the organic acid salt to the solder powder continuously dropped or by dipping the solder powder into his solution. The solubility of the organic acid salt in the saturated solution dipped with the solder powder is gradually lowered by dripping alcohol etc., to form the thin film of the organic acid salt coated on the surface of the soldering powder.
Inventors:
Masahiko Hirata
Koji Ohashi
Hisahiko Yoshida
Hiroshi Noguchi
Takao Hisakuno
Sena Ho
Tetsuhiko Isobe
Koji Ohashi
Hisahiko Yoshida
Hiroshi Noguchi
Takao Hisakuno
Sena Ho
Tetsuhiko Isobe
Application Number:
JP18763799A
Publication Date:
February 25, 2009
Filing Date:
July 01, 1999
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
B23K35/40; B22F1/02; B23K35/22; B23K35/26; B23K35/363; H05K3/34
Domestic Patent References:
| JP10058190A | ||||
| JP1157793A | ||||
| JP10175092A | ||||
| JP3013293A | ||||
| JP4362104A | ||||
| JP4264302A |
Attorney, Agent or Firm:
Hiroyuki Ikeuchi
Kimihiro Sato
Kimihiro Sato