Title:
半導体製造装置
Document Type and Number:
Japanese Patent JP4235468
Kind Code:
B2
Abstract:
An exposure apparatus which projects a pattern of an original onto a substrate. The apparatus includes an original stage which supports the original, a substrate stage which supports the substrate, a reference pattern which is arranged on the original stage and to align the original stage and the substrate stage, and a mark, which is arranged on the original stage, has a known relative position from the reference pattern, and is to be projected onto the substrate to form an alignment mark on the substrate.
Inventors:
Hiroshi Tanaka
Application Number:
JP2003053896A
Publication Date:
March 11, 2009
Filing Date:
February 28, 2003
Export Citation:
Assignee:
Canon Inc
International Classes:
G03F7/20; G03B27/42; H01L21/027; G03F9/00; H01L23/544
Domestic Patent References:
| JP3089356A | ||||
| JP61004037A | ||||
| JP6244078A |
Attorney, Agent or Firm:
Yasunori Otsuka
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura