Title:
半導体装置
Document Type and Number:
Japanese Patent JP4236402
Kind Code:
B2
Abstract:
A semiconductor device is provided with temperature compensation functions and a temperature change detecting device is provided which detect temperature changes accurately, without requiring extra mounting space. A sensor unit (30) is composed of first semiconductor components (first-type resistors 30b and 30d) having a certain temperature coefficient and second semiconductor components (second-type resistors 30a and 30c) having a different temperature coefficient. They are located in the vicinity of a processing circuit (33) that needs temperature compensation. Changes in the temperature of the processing circuit (33) are detected by a temperature change detector (31) which observes a certain property (e.g., resistance) of the first and second semiconductor components constituting the sensor unit (30). A temperature corrector (32) corrects functions of the processing circuit (33) according to the detection result provided from the temperature change detector (31).
Inventors:
Hiromi Namba
Kenichi Minobe
Kenichi Minobe
Application Number:
JP2001311594A
Publication Date:
March 11, 2009
Filing Date:
October 09, 2001
Export Citation:
Assignee:
Fujitsu Microelectronics Limited
International Classes:
G01K7/20; G01K7/24; G05D23/24; G06F1/20; H01L21/822; H01L27/04; H03J3/04
Domestic Patent References:
| JP8062055A | ||||
| JP10276110A | ||||
| JP4172805A | ||||
| JP3022065B2 |
Attorney, Agent or Firm:
Takeshi Hattori