Title:
重合体、レジスト組成物、およびパターン形成方法
Document Type and Number:
Japanese Patent JP4236423
Kind Code:
B2
Inventors:
Ryuichi Anzai
Masayuki Fujiwara
Ueda Akifumi
Masayuki Fujiwara
Ueda Akifumi
Application Number:
JP2002211343A
Publication Date:
March 11, 2009
Filing Date:
July 19, 2002
Export Citation:
Assignee:
Mitsubishi Rayon Co., Ltd.
International Classes:
C08F20/28; G03F7/039; H01L21/027
Domestic Patent References:
| JP1242681A | ||||
| JP64033182A | ||||
| JP2000026446A | ||||
| JP2003040894A | ||||
| JP2001296661A | ||||
| JP2002040662A | ||||
| JP2002031890A | ||||
| JP2004051995A |
Previous Patent: 表示装置
Next Patent: SEMICONDUCTOR WAFER PROVIDED WITH INSULATING FILM AND MANUFACTURE THEREOF
Next Patent: SEMICONDUCTOR WAFER PROVIDED WITH INSULATING FILM AND MANUFACTURE THEREOF