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Patent Searching and Data


Title:
半導体集積回路装置の製造方法
Document Type and Number:
Japanese Patent JP4236848
Kind Code:
B2
Inventors:
原田 博文
小山内 潤
Application Number:
JP2002035536A
Publication Date:
March 11, 2009
Filing Date:
February 13, 2002
Export Citation:
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Assignee:
セイコーインスツル株式会社
International Classes:
H01L21/8238; H01L27/088; H01L27/092; H01L29/78
Domestic Patent References:
JP9129868A
JP8055914A
JP8186179A
JP7153952A
JP4335538A
JP2000223705A
JP2001044435A
JP11307729A
JP9260663A
JP2000323706A
JP2000188397A
JP2000323654A
JP11354794A
JP6334120A
Attorney, Agent or Firm:
松下 義治