Title:
樹脂組成物、半導体装置用接着剤付きフィルム、金属箔付き積層フィルム及びそれを用いた半導体装置
Document Type and Number:
Japanese Patent JP4238525
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition which has an excellent low thermal expansion coefficient and an excellent high elastic modulus, and to provide an adhesive which has excellent reflow resistance and excellent adhesiveness and is used for semiconductors. SOLUTION: This resin composition is characterized by containing inorganic fine particles which have a structure having two or more separated phases and having an average primary particle diameter of <=0.1 μm.
Inventors:
Koichi Fujimaru
Nobuo Matsumura
Toshio Yoshimura
Nobuo Matsumura
Toshio Yoshimura
Application Number:
JP2002183021A
Publication Date:
March 18, 2009
Filing Date:
June 24, 2002
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
B32B15/08; C08L77/00; C08K3/00; C08L63/00; C08L101/00; C09J7/02; C09J11/04; C09J163/00; C09J177/00; C09J201/00; H01L21/60
Domestic Patent References:
| JP2001089628A | ||||
| JP9216245A | ||||
| JP2002363389A | ||||
| JP2001138448A |