少なくとも一つの要素を初期支持体から最終支持体まで選択的に移送する方法

Japanese Patent JP4249490

B2

The invention concerns a process of selective transfer of labels from an initial support to a final support, each label including at least one element constituent of a microelectronic and/or optoelectronic and/or acoustic and/or mechanical device, with the elements made in a surface layer of the initial support, and the process including the following stages: a) Fixing a transfer support on the surface layer of the initial support; b) Eliminating the part of the initial support that does not correspond to the surface layer; c) Laterally defining the labels by cutting according to the thickness of the surface layer, with the cutting leaving zones to be broken off; d) Grasping one or several labels to be transferred and tearing them off by means of energy intake in the corresponding zones that can be broken off; e) Transfer and fixing the label or set of labels torn off in stage d) on the final support.

JP2915350	[Title of the Invention] Ultrasonic vibration bonding chip mounting device
WO/2015/001583	Electronic Assembly for Prognostics of Solder Joint

Christoph Fig
Bernard Aspearl
Vincent Bure

JP2002580377A

April 02, 2009

April 02, 2002

Click for automatic bibliography generation  

COMPAGNIE GENERALE DES MATIERES NUCLEAIRES

H01L21/52; H01L21/02; H01L21/68; H01L21/98; H01S5/02

JP1225131A
JP2000153420A
JP2000150544A
JP7106285A
JP2000514937A
JP7078795A
JP8195362A

US6013534
US5391257

Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
Shinya Mitsuhiro

Previous Patent: 内燃焼エンジンの排気ガスに含まれる粒子を濾過する濾過体

Next Patent: MULTI-DIMENSION PICTURE COMPRESSION AND EXPANSION SYSTEM