Title:
X線センサーユニット、これを用いたX線撮影装置
Document Type and Number:
Japanese Patent JP4251386
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an X-ray sensor unit in which a problem caused by a joint between imaging devices can be solved while using a directly connected two-dimensional(2D) semiconductor X-ray imaging device. SOLUTION: When successively providing, a plurality of 2D semiconductor X-ray imaging devices 2a equipped with detection surfaces 2d where imaging planes 2f are directly laminated just under X-ray incident planes 2e, in the form of line to link the detection surfaces 2d, the 2D semiconductor X-ray imaging devices 2a are successively provided so that a successive providing plane 2h can be inclined to a direction vertical to a successive providing line direction R formed by such successive providing and that the successive providing line direction R can be vertical to a scanning direction D for scanning X-rays transmitted through an object.
Inventors:
Yoshinori Arai
Masakazu Suzuki
Masakazu Suzuki
Application Number:
JP2001190731A
Publication Date:
April 08, 2009
Filing Date:
June 25, 2001
Export Citation:
Assignee:
NIHON UNIVERSITY
Morita Manufacturing Co., Ltd.
Morita Manufacturing Co., Ltd.
International Classes:
A61B6/14; A61B6/00; G01T1/24; H01L27/14; H04N5/32; H04N7/18
Domestic Patent References:
| JP11511035A |
Attorney, Agent or Firm:
Hiroyuki Nakai