Title:
化学機械研磨用スラリおよび半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4253141
Kind Code:
B2
Inventors:
Southern study
Kurashima Nobuyuki
Hiroyuki Yano
Nobuo Kawahashi
Masayuki Hattori
Kazuo Nishimoto
Kurashima Nobuyuki
Hiroyuki Yano
Nobuo Kawahashi
Masayuki Hattori
Kazuo Nishimoto
Application Number:
JP2001250570A
Publication Date:
April 08, 2009
Filing Date:
August 21, 2001
Export Citation:
Assignee:
Toshiba Corporation
JSR CORPORATION
JSR CORPORATION
International Classes:
H01L21/304; B24B37/00; B82Y10/00; B82Y99/00; C09K3/14; H01L21/3205; H01L21/321; H01L21/768; H01L23/52; H01L23/532
Foreign References:
| WO1997029510A1 |
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Sadao Muramatsu
Ryo Hashimoto
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