Title:
電気光学装置用基板の製造方法及び電気光学装置の製造方法
Document Type and Number:
Japanese Patent JP4266842
Kind Code:
B2
Abstract:
A method for manufacturing an electro-optical device board including on a substrate a switching element and a coupling wiring coupled to the switching element is provided. The method includes the steps of forming the switching element and first coupling wirings simultaneously by patterning using light irradiation; and forming second coupling wirings by an additive patterning process.
Inventors:
Takeo Kawase
Soichi Moriya
Mitsuaki Harada
Soichi Moriya
Mitsuaki Harada
Application Number:
JP2004025446A
Publication Date:
May 20, 2009
Filing Date:
February 02, 2004
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
G09F9/00; G02F1/167; G09F9/30; H01L21/00; H01L21/28; H01L21/288; H01L21/3205; H01L21/336; H01L29/786; H01L51/00; H01L51/05; H01L51/40
Domestic Patent References:
| JP4324832A | ||||
| JP2003518332A | ||||
| JP2003337576A |
Foreign References:
| WO2003098696A1 |
Attorney, Agent or Firm:
Kazuya Nishi
Masatake Shiga
Masakazu Aoyama
Masatake Shiga
Masakazu Aoyama
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