Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP4275488
Kind Code:
B2
Abstract:
A substrate processing apparatus for drying a substrate including a chamber, a vapor supply part, an open/close valve, and a controller, is disclosed. While the chamber is hermetically sealed, a substrate is cleaned by pure water. Water vapor of high temperature and pressure is thereafter supplied from the vapor supply part, to raise the temperature and pressure in the chamber. When the substrate surface is covered with pure water at a temperature of 100 degrees centigrade or higher, the controller brings the open/close valve to an open state to release the ambient atmosphere in the chamber in the atmosphere outside, thereby instantaneously bringing the chamber to a condition of reduced pressure. As a result, water mark formation caused by processing solution adhering to the substrate is suppressed in the drying process.
Inventors:
Nagami Sozo
Hidehiko Ozaki
Hidehiko Ozaki
Application Number:
JP2003295173A
Publication Date:
June 10, 2009
Filing Date:
August 19, 2003
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
H01L21/304; H01L21/306; B08B3/00; B08B7/04; H01L21/00; H01L21/027
Domestic Patent References:
| JP6283497A | ||||
| JP64020625A | ||||
| JP9246231A | ||||
| JP2000183134A | ||||
| JP10144651A |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita