Title:
湿分反応性ホットメルト接着剤
Document Type and Number:
Japanese Patent JP4279155
Kind Code:
B2
Abstract:
A moisture-reactive hot-melt adhesive composition, useful as an adhesive, is provided. The composition is particularly useful as an adhesive for bonding profile-wrap articles. Also provided are a method for making profile-wrap articles using the composition and the profile-wrap articles so made.
Inventors:
Mark Alan Kesselmeyer
Application Number:
JP2004007921A
Publication Date:
June 17, 2009
Filing Date:
January 15, 2004
Export Citation:
Assignee:
ROHM AND HAAS COMPANY
International Classes:
C09J175/06; C08G18/12; C08G18/40; C08G18/66; C09J5/06; C09J123/08; C09J133/00; C09J175/04; C09J175/08; C08L33/00; C08L33/04
Domestic Patent References:
| JP2001503465A |
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office