To provide a structure and a manufacturing technique of a photoelectric conversion device formed on a glass substrate, which increases bonding strength when mounting the device on a circuit board.
This invention is related to the bottom electrode structure of a surface-mounting-type photoelectric conversion device formed on a glass substrate. The bottom electrode is formed on the surface opposite to the light receiving surface of the photoelectric conversion device, and takes out the output. The inner layer of the bottom electrode, which is in contact with a semiconductor layer, is made of a first metal material or an oxide-based conductive material which forms an ohmic contact with the semiconductor layer. The outer layer, which is connected to an external circuit, has a laminated structure made of a second metal material which can be alloyed with solder.
COPYRIGHT: (C)2004,JPO
Kazuo Nishi
Hiroki Adachi
Yusuke Sugawara
Hideaki Ninomiya
tdk Corporation
| JP7192663A | ||||
| JP10051033A | ||||
| JP3145739A |