Title:
ブリスターパックの底面に中身の注型物に移すしるしを成形する方法
Document Type and Number:
Japanese Patent JP4284000
Kind Code:
B2
Abstract:
The invention herein relates to a method and apparatus for forming (or cold-forming) an embossed blister from a laminated film wherein an indicia is formed on the base of the blister. In particular, the invention involves a single pass process of combining the formation of a blister and the formation of an indicia (embossing) on the blister, wherein the blister-forming pin contains a face with an indicia and is adapted to controllably stretch the laminated film during blister formation to minimize stretching of the film at the base of the blister. The invention is particularly useful in manufacturing processes which involve the formation of blisters having laminated films which contain a metal foil and polymer layer, wherein improved control in the stretching of the laminate during blister formation is desirable.
More Like This:
Inventors:
Heath, kenneth
Application Number:
JP2000564793A
Publication Date:
June 24, 2009
Filing Date:
August 06, 1999
Export Citation:
Assignee:
Earl, Pee, Schaller Corporation
International Classes:
B29C51/08; B29C51/30; B29C51/14; B29C67/00; B29C33/00; B29C59/02; B29L9/00
Domestic Patent References:
| JP55128426A | ||||
| JP4041282B2 | ||||
| JP9506268A |
Foreign References:
| WO1997021534A1 | ||||
| WO1997010162A1 |
Attorney, Agent or Firm:
Hideto Asamura
Hajime Asamura
Sadafumi Kobori
Yukihiro Ikeda
Hajime Asamura
Sadafumi Kobori
Yukihiro Ikeda