Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4285946
Kind Code:
B2
Inventors:
Yasuhiro Sugada
Application Number:
JP2002165477A
Publication Date:
June 24, 2009
Filing Date:
June 06, 2002
Export Citation:
Assignee:
Renesas Technology Corp.
International Classes:
H01L21/28; H01L21/3205; C23C14/50; H01L21/768; H01L23/52
Domestic Patent References:
| JP2000133712A | ||||
| JP5074740A |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa