Title:
コネクタ用銅合金およびその製造法
Document Type and Number:
Japanese Patent JP4294196
Kind Code:
B2
Abstract:
Copper alloy having the basic composition Cu-Zn-Sn contains 23-28 wt % Zn and 0.3-1.8 wt % Sn and satisfies the relation 6.0<=0.25X+Y<=8.5 (where X is the addition of Zn in wt % and Y is the addition of Sn in wt %). The alloy is cast into an ingot by melting and cooling over the range from the liquidus line to 600° C. at a rate of at least 50° C./min; the ingot is hot rolled at a temperature not higher than 900° C. and then subjected to repeated cycles of cold rolling and annealing at 300-650° C. to control the size of crystal grains, thereby producing a rolled strip having a 0.2% yield strength of at least 600 N/mm<2>, a tensile strength of at least 650 N/mm<2>, an electrical conductivity of at least 20% IACS, a Young's modulus of no more than 120 kN/mm<2 >and a percent stress relaxation of no more than 20%.
Inventors:
Akira Sugawara
Kazuki Hatakeyama
Ryo
Kazuki Hatakeyama
Ryo
Application Number:
JP2000113520A
Publication Date:
July 08, 2009
Filing Date:
April 14, 2000
Export Citation:
Assignee:
DOWA Metal Tech Co., Ltd.
International Classes:
C22C9/04; C22F1/08; C22F1/00
Domestic Patent References:
JP11036028A | ||||
JP10081926A | ||||
JP56084434A | ||||
JP63026320A | ||||
JP60086230A | ||||
JP2197543A | ||||
JP4358033A | ||||
JP6212374A | ||||
JP2000087158A | ||||
JP64087737A | ||||
JP62146230A | ||||
JP2001164328A |
Attorney, Agent or Firm:
Kenji Wada
Komatsu Taka
Komatsu Taka