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Title:
フレーク状銅粉およびその製造法
Document Type and Number:
Japanese Patent JP4296347
Kind Code:
B2
Abstract:

To obtain flaky copper powders suitable to a filler for electrically conductive paste.

The flaky copper powders consist of copper particles having a flaky shape with the average thickness (D) of ≥0.2 μm, and in which the 50% size (D50) in the particle size distribution is 1 to 30 μ, the aspect ratio (D50/the average thickness D) is 5 to 70, the A value in the following formula is ≤0.1, and the B value in the following formula is ≤0.5: A value=SD/(D90/D10) and B value=SD/D; wherein, D is the average thickness in 100 pieces of the particles measured by electron microscope observation; SD is the standard deviation of the thickness in 100 pieces of the particles measured by electron microscope observation; D90 is the 90% size (D90) in the particle size distribution; and D10 is the 10% size (D10) in the particle size distribution.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Hideta Fujita
Akira Hirata
Junji Harano
Application Number:
JP2004010193A
Publication Date:
July 15, 2009
Filing Date:
January 19, 2004
Export Citation:
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Assignee:
dowa Electronics Co., Ltd.
International Classes:
B22F1/00; B22F9/04; H01B1/00; H01B1/22
Domestic Patent References:
JP5225823A
JP8325612A
JP9268301A
JP11264001A
JP2003119501A
JP2003123537A
Attorney, Agent or Firm:
Kenji Wada
Komatsu Taka



 
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