Title:
コンタクトホールの形成方法、これを用いた回路基板及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4300587
Kind Code:
B2
Inventors:
Soichi Moriya
Takeo Kawase
Mitsuaki Harada
Yukihisa Saeki
Tomoyuki Okuyama
Hirofumi Hokari
Takashi Aoki
Takeo Kawase
Mitsuaki Harada
Yukihisa Saeki
Tomoyuki Okuyama
Hirofumi Hokari
Takashi Aoki
Application Number:
JP2006304423A
Publication Date:
July 22, 2009
Filing Date:
November 09, 2006
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L21/768; H01L21/28; H01L23/522; H01L29/786
Domestic Patent References:
| JP2006041180A | ||||
| JP2005215616A | ||||
| JP11330235A | ||||
| JP2021507A | ||||
| JP7326614A | ||||
| JP2002033583A | ||||
| JP11163133A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Katsuro Tanaka
Shinji Oga
Katsuro Tanaka
Shinji Oga