Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4301138
Kind Code:
B2
Inventors:
Kiyota Hisaharu
Application Number:
JP2004306148A
Publication Date:
July 22, 2009
Filing Date:
October 20, 2004
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/28; H01L29/78; H01L21/283; H01L29/423; H01L29/49
Domestic Patent References:
| JP3018034A | ||||
| JP1243471A | ||||
| JP4336466A | ||||
| JP63283064A | ||||
| JP63017544A |
Attorney, Agent or Firm:
Toru Takatsuki