Title:
DBC回路基板用窒化アルミニウム焼結体の製造方法およびDBC回路基板の製造方法
Document Type and Number:
Japanese Patent JP4301617
Kind Code:
B2
Inventors:
Komatsu
Application Number:
JP37127598A
Publication Date:
July 22, 2009
Filing Date:
December 25, 1998
Export Citation:
Assignee:
Toshiba Corporation
Toshiba Materials Co., Ltd.
Toshiba Materials Co., Ltd.
International Classes:
C04B35/581; H01L23/373
Domestic Patent References:
| JP9025166A | ||||
| JP6329474A | ||||
| JP5178671A |
Attorney, Agent or Firm:
Hisashi Hatano
Shunguchi Sekiguchi
Akio Saruwatari
Osamu Kawamura
Shunguchi Sekiguchi
Akio Saruwatari
Osamu Kawamura