Title:
複数ポンプを有する電子液体冷却システム
Document Type and Number:
Japanese Patent JP4302659
Kind Code:
B2
Abstract:
A pump assembly includes inlet and outlet interfaces capable of coupling to a liquid cooling loop tubing, a plurality of pump connectors coupled to the inlet and outlet interfaces enabling pluggable connection of a plurality of pumps to the inlet and outlet interfaces, and a controller. The controller is coupled to the plurality of pumps and controls power levels of the individual pumps, enabling control of fluid flow rate in the liquid cooling loop.
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Inventors:
Christopher Malone
Glenci. Simon
Glenci. Simon
Application Number:
JP2005108332A
Publication Date:
July 29, 2009
Filing Date:
April 05, 2005
Export Citation:
Assignee:
Hewlett-Packard Development Company
International Classes:
F04D15/00; F04B19/00; F04B23/06; F04B39/00; F04B49/00; F04D13/12; H01L23/473; H05K7/20
Domestic Patent References:
| JP2003029879A | ||||
| JP62029774A | ||||
| JP3099179A | ||||
| JP3107589A | ||||
| JP5231373A | ||||
| JP10176692A | ||||
| JP2003243869A | ||||
| JP2002188876A | ||||
| JP2004047921A | ||||
| JP2003507162A | ||||
| JP2000104659A | ||||
| JP7083400A |
Foreign References:
| US20030062149 | ||||
| WO2003029731A1 |
Attorney, Agent or Firm:
Masaki Goto
Yoshio Matsuda
Hideo Ueno
Masaaki Iida
Yoshio Matsuda
Hideo Ueno
Masaaki Iida
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