Title:
半導体装置
Document Type and Number:
Japanese Patent JP4303547
Kind Code:
B2
Abstract:
In a semiconductor device, a circuit unit is formed in an inside portion, and seal rings that enclose the inside portion that are composed of walls of metal layers are formed around the periphery. In the corners, the seal rings include linear parts that extend inwardly in addition to the linear parts that extend along the periphery, whereby the seal rings are formed in a planar pattern having small rectangular planar patterns in each corner.
Inventors:
Akira Matsumoto
Iguchi Manabu
Masahiro Komuro
Fukase Tadashi
Iguchi Manabu
Masahiro Komuro
Fukase Tadashi
Application Number:
JP2003324210A
Publication Date:
July 29, 2009
Filing Date:
September 17, 2003
Export Citation:
Assignee:
NEC Electronics Corporation
International Classes:
H01L21/822; H01L23/52; H01L21/3205; H01L21/82; H01L23/00; H01L23/28; H01L27/04
Domestic Patent References:
| JP2003338504A | ||||
| JP2001053148A |
Attorney, Agent or Firm:
Mitsuhiro Hamada