Title:
スペーサ
Document Type and Number:
Japanese Patent JP4303609
Kind Code:
B2
Abstract:
The spacer is formed as an elastic member with no ends thereof, which is detachably attached, by exploiting its elastic deformation, onto a printed wiring board to which is fixed an electronic component having a component package, on one of whose surfaces connection terminals are arranged. Since the spacer is attached on the printed wiring board to enclose an electronic component so as to seal a gap formed between the electronic component and a printed wiring board, it is possible to prevent foreign objects entering the gap, so that failures, such as insufficient insulation, caused by such foreign objects are also prevented. Since the spacer is easily removed from the printed wiring board, it is recyclable and economical.
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Inventors:
Yoshinori Unzuka
Masahiro Suzuki
Takeshi Nishiyama
Yoshimaru Masaki
Hirotoshi Muraishi
Masahiro Suzuki
Takeshi Nishiyama
Yoshimaru Masaki
Hirotoshi Muraishi
Application Number:
JP2004020999A
Publication Date:
July 29, 2009
Filing Date:
January 29, 2004
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K1/18; H01G5/10; H05K3/30
Domestic Patent References:
| JP2000031320A | ||||
| JP6023276U | ||||
| JP11177204A | ||||
| JP2001060842A | ||||
| JP2002195410A |
Attorney, Agent or Firm:
Yu Sanada