Title:
半導体封止用樹脂組成物包装体およびそれを用いた半導体装置の製法
Document Type and Number:
Japanese Patent JP4308097
Kind Code:
B2
Inventors:
Hisa Ito
Shinya Daejeon
Suzuki Tomichi
Shinya Daejeon
Suzuki Tomichi
Application Number:
JP2004200572A
Publication Date:
August 05, 2009
Filing Date:
July 07, 2004
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
B65D77/20; H01L21/56
Domestic Patent References:
| JP9174591A | ||||
| JP8197567A | ||||
| JP10172996A | ||||
| JP9117931A | ||||
| JP2260438A | ||||
| JP6291158A |
Attorney, Agent or Firm:
Masahiko Nishito
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