Title:
回路基板組立体
Document Type and Number:
Japanese Patent JP4318201
Kind Code:
B2
Inventors:
Hideshi Harada
Hideki Motoyanagi
Toshifumi Koizumi
Keiya Utsumi
Hideki Motoyanagi
Toshifumi Koizumi
Keiya Utsumi
Application Number:
JP2003051746A
Publication Date:
August 19, 2009
Filing Date:
February 27, 2003
Export Citation:
Assignee:
YAMATAKE CORPORATION
International Classes:
H05K1/14; H05K3/32; H05K3/36
Domestic Patent References:
| JP9083132A | ||||
| JP51047865U | ||||
| JP2082083U | ||||
| JP52125777A | ||||
| JP2001345133A | ||||
| JP7307545A | ||||
| JP4116177U | ||||
| JP53160749U |
Attorney, Agent or Firm:
Koji Nagato
Junichi Yamanaka
Junichi Yamanaka