希土類含有合金薄片の製造方法、希土類磁石用合金薄片、希土類焼結磁石用合金粉末、希土類焼結磁石、ボンド磁石用合金粉末、及びボンド磁石

Title:

希土類含有合金薄片の製造方法、希土類磁石用合金薄片、希土類焼結磁石用合金粉末、希土類焼結磁石、ボンド磁石用合金粉末、及びボンド磁石

Document Type and Number:

Japanese Patent JP4318204

Kind Code:

B2

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Inventors:

Shiro Sasaki

Application Number:

JP2003132582A

Publication Date:

August 19, 2009

Filing Date:

May 12, 2003

Export Citation:

Assignee:

SHOWA DENKO K.K.

International Classes:

B22D11/06; B22F1/00; B22F9/04; C22C38/00; H01F1/06; H01F1/08

Domestic Patent References:

Attorney, Agent or Firm:

Kenzo Fukuda
Shinichi Fukuda
Takemichi Fukuda

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