伝送線路実装体、およびインターフェイスモジュール付LSIパッケージ

Title:

伝送線路実装体、およびインターフェイスモジュール付LSIパッケージ

Document Type and Number:

Japanese Patent JP4319599

Kind Code:

B2

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Inventors:

Hideto Koyama
Hideo Numata
Hiroshi Hamasaki
Tomoaki Takubo

Application Number:

JP2004237723A

Publication Date:

August 26, 2009

Filing Date:

August 17, 2004

Export Citation:

Assignee:

Toshiba Corporation

International Classes:

H05K1/02; G02B6/42; H05K7/00

Domestic Patent References:

Attorney, Agent or Firm:

Saichi Suyama

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