光半導体装置、光通信装置および電子機器

Title:

光半導体装置、光通信装置および電子機器

Document Type and Number:

Japanese Patent JP4348267

Kind Code:

B2

Abstract:

To provide an optical semiconductor device exhibiting appropriate light transmittance for a temperature within an operating temperature range and excellent operational characteristics within the operating temperature range, and to provide a communication apparatus equipped with the optical semiconductor device, and an electronic apparatus equipped with the optical semiconductor device.

An LED 2 mounted to a lead frame 1 is sealed with a translucent mold resin 4 added with a filler by transfer molding. The translucent mold resin 4 has such characteristics as its transmittance increases for a temperature rise within the operating temperature range of an optical semiconductor device.

Inventors:

Nobuyuki Oe
Kazuto Nakura

Application Number:

JP2004274695A

Publication Date:

October 21, 2009

Filing Date:

September 22, 2004

Export Citation:

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