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Title:
セラミック静電チャックアセンブリ及びその作製方法
Document Type and Number:
Japanese Patent JP4349901
Kind Code:
B2
Abstract:
A sintered ceramic electrostatic chucking device (ESC) which includes a patterned electrostatic clamping electrode embedded in a ceramic body wherein the clamping electrode includes at least one strip of a sintered electrically conductive material arranged in a fine pattern. Due to the fineness of the electrode pattern employed, stresses induced during manufacture of the ESC are reduced such that the clamping electrode remains substantially planar after the sintering operation. The resulting ESC allows for improved clamping uniformity. Another ESC includes an insulating or semi-conducting body and a clamping electrode having a high resistivity and or a high lateral impedance. The electrostatic chucking device provides improved RF coupling uniformity when RF energy is coupled thorough the clamping electrode from an underlying RF electrode. The RF electrode can be a separate baseplate or it can be a part of the chuck. The ESC's may be used to support semiconductor substrates such as semiconductor wafers in plasma processing equipment.

Inventors:
Nakajima, Shu
Benjamin, Neil
Application Number:
JP2003509527A
Publication Date:
October 21, 2009
Filing Date:
June 10, 2002
Export Citation:
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Assignee:
LAM RESEARCH CORPORATION
International Classes:
H01L21/3065; H01L21/683; H02N13/00
Domestic Patent References:
JP1274938A
JP10080168A
JP11297805A
JP11297804A
JP9237826A
JP2000277495A
JP8078193A
Foreign References:
WO2001043184A1
Attorney, Agent or Firm:
Yasunori Otsuka
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Nagakawa Yukimitsu
Nishikawa Keio