To provide a semiconductor device and a camera module which has a small structure and can prevent a short-circuit between terminals at the time of being mounted on a wiring board even if a pattern interconnection is exposed outside.
The semiconductor device comprises a semiconductor element 12, molding resin 14 for sealing the semiconductor element, project 16 formed in a projecting state on the front surface of the molding resin, the pattern interconnection 20 which is formed on the front surface of the molding resin and is electrically connected to electrodes of the semiconductor element, external connection terminal 18 which is formed on the project and is connected to the pattern interconnection, and annular insulation film 24 arranged around the external connection terminal formed on the project so as to partially coat the pattern interconnection.
COPYRIGHT: (C)2006,JPO&NCIPI
| JP11163204A | ||||
| JP7022466A | ||||
| JP2002313832A |
Koichi Itsubo
Higuchi Souji
Masami Enohara
Kurachi Yasuyuki
Ryu Kobayashi