To provide a transfer apparatus capable of stably transferring a component, a surface mounting machine, an IC handler, and a thickness measuring method.

When an image of the lower surface of an electronic component is captured by a 0-degree line sensor 5 and a θ-degree line sensor 6, an image processing unit 72 carries out image processing for this image and detects the central position C of the electronic component together with the screen center of the recognition screen of each line sensor. A main arithmetic unit 76 computes the actual thickness T2 of the electronic component based on displacements of the detected central position C of the electronic component and the screen center of the recognition screen of each line sensor in the imaging direction (X axis direction) of each line sensor.

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