薄膜基板を処理するための方法

Japanese Patent JP4359657

B2

The present invention comprises a processed thin film substrate ( 10 ) and a method therefore, in order to produce a flexible printed circuit card, having a plurality of microvias going or passing through the thin film substrate and electrically connected along faced-away surfaces, in order to form an electric circuit. A first a number of real nano-tracks are filled with a first material (M 1 ), having good electric properties, for the formation of a first number of, here denominated, first vias (V 10 , V 30 , V 50 ), that a second number of real nano-tracks are filled with a second material (M 2 ), having good electric properties, for the formation of a second number of, here denominated, second vias (V 20 , V 40 , V 60 ). The first material (M 1 ) and the second material (M 2 ) of said first and second vias (V 10 -V 60 ) are chosen having mutually different thermoelectric properties. A material surface-applied to the thin film substrate, coated on both sides ( 10 a , 10 b) of the thin film substrate ( 10 ), is distributed and/or adapted in order to allow the electrical interconnection of first vias, allocated the first material (M 1 ), with second vias, allocated the second material (M 2 ), and that a first via (V 10 ) included in a series connection and a last via (V 60 ) included in the series connection are serially co-ordinated in order to form an electric thermocouple ( 100 ) or other circuit arrangement.

Martin, Hans Yelan Ewald
Yort, Class Andes
Lindberg, Michael Peter Eric

JP2006508027A

November 04, 2009

April 21, 2004

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JonDeTech AB

H05K1/11; G01J3/02; H05K3/00; H05K3/14; H05K3/40

JP2002353523A
JP2047141A
JP5243727A
JP64049298A

Hironobu Onda
Makoto Onda
Atsushi Honda
Miho Ikegami

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