Title:
ウェーハ裏面の処理装置及び方法
Document Type and Number:
Japanese Patent JP4371391
Kind Code:
B2
Inventors:
Masato Tsuchiya
Shunichi Ogasawara
Shunichi Ogasawara
Application Number:
JP2000307706A
Publication Date:
November 25, 2009
Filing Date:
October 06, 2000
Export Citation:
Assignee:
Sanyasu Semiconductor Industry Co., Ltd.
International Classes:
B08B3/04; H01L21/304
Domestic Patent References:
| JP2000183014A | ||||
| JP3211721A |
Attorney, Agent or Firm:
Shoji Ishihara
Shinsuke Ishihara
Shinsuke Ishihara