Title:
バンプボンディング用加熱装置
Document Type and Number:
Japanese Patent JP4371497
Kind Code:
B2
Abstract:
An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method, a bump forming apparatus which do not involve large-sized apparatus configuration and which are easy to handle, and a semiconductor wafer in which bumps are formed by using the bump bonding method. The bump-bonding heating apparatus has a wafer turning member 111, a turning unit 112 and a wafer heating unit 113. The turning member is turned by the turning unit without turning the wafer heating unit, whereby a semiconductor wafer 201 mounted on the turning member is turned. Like this, since the wafer heating unit is not turned, apparatus configuration can be compacted. Since the turning member is turned directly by the turning unit, the turning angle of the semiconductor wafer can be implemented with higher precision as compared with the conventional gas floating type turning method.
Inventors:
Narita Masariki
Makoto Imanishi
Takaharu Mae
Nobuhisa Watanabe
Shinji Kanayama
Makoto Imanishi
Takaharu Mae
Nobuhisa Watanabe
Shinji Kanayama
Application Number:
JP29663199A
Publication Date:
November 25, 2009
Filing Date:
October 19, 1999
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H01L21/60; H01L21/00; H01L21/68
Domestic Patent References:
| JP6232131A | ||||
| JP10163214A | ||||
| JP11205079A | ||||
| JP2107497A |
Attorney, Agent or Firm:
Aoyama Aoi
Mitsuo Wada
Mitsuo Wada