Title:
超塑性成形用金型の開閉装置への設置構造
Document Type and Number:
Japanese Patent JP4375736
Kind Code:
B2
Abstract:
To provide the structure for installation of a superplastic forming die on an opening/closing device by which the thermal expansion of the forming die is absorbed by a small-sized and simple structure.
In the structure for installation of the forming die 12 consisting of upper and lower dies 14, 13 which are thermally expanded at superplastic forming on the opening and closing device 36, in detail, a ram 21, the upper die 14 is arranged movably on at least one side of the vertical direction or the horizontal direction to the opening/closing device 36 while following the thermal expansion of the lower die 13.
COPYRIGHT: (C)2006,JPO&NCIPI
Inventors:
Masahiro Inoue
Kazuya Saito
Keiichiro Nakao
Kazuya Saito
Keiichiro Nakao
Application Number:
JP2004238420A
Publication Date:
December 02, 2009
Filing Date:
August 18, 2004
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
B21D26/02; B21D26/021; B21D26/025; B21D26/055; B21D37/14
Domestic Patent References:
| JP2001129622A | ||||
| JP63317223A |
Attorney, Agent or Firm:
Yoichiro Shimoda
Tamiya Hiroshi
Tamiya Hiroshi