Title:
空乏SOI型半導体装置から構成された集積回路
Document Type and Number:
Japanese Patent JP4389300
Kind Code:
B2
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Inventors:
Nakayama So
Application Number:
JP21547799A
Publication Date:
December 24, 2009
Filing Date:
July 29, 1999
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L27/12; H01L29/786; H01L23/52
Domestic Patent References:
| JP5218434A | ||||
| JP10074061A | ||||
| JP8330541A | ||||
| JP10247394A | ||||
| JP5102791A |
Attorney, Agent or Firm:
Takahisa Yamamoto