Title:
接続材料、接続材料の製造方法、および半導体装置
Document Type and Number:
Japanese Patent JP4390799
Kind Code:
B2
Abstract:
In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt.% or a Zn content of the Zn series alloy layer is 90 to 100 wt.%. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn-Al alloy can be obtained. Further, a high connection reliability can be achieved when an Al series alloy layer is left after the connection, since the soft Al thereof functions as a stress buffer material.
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Inventors:
Yasushi Ikeda
Masahide Okamoto
Masahide Okamoto
Application Number:
JP2006314168A
Publication Date:
December 24, 2009
Filing Date:
November 21, 2006
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B23K35/14; B23K35/28; B23K35/40; C22C18/04; H01L21/52; H01L21/60; H01L23/10
Domestic Patent References:
| JP62173095A | ||||
| JP58077784A | ||||
| JP2002307188A |
Attorney, Agent or Firm:
Yamato Tsutsui