Title:
ACF貼り付け装置
Document Type and Number:
Japanese Patent JP4392766
Kind Code:
B2
Abstract:
An ACF attaching apparatus and a flat display device are provided to apply uniform pressurization in a total length of a substrate when attaching the ACF to the substrate. A substrate support supports a substrate horizontally. A half cut unit cuts an ACF at an attachment length for each electrode group of the substrate. An attachment unit includes a pressing head(50) to pressurize the cut ACF on the surface of the substrate. The pressing head includes a pressurization edge(51) and a reception edge(52). The pressurization edge and the reception edge include a lift driving unit driven to an approach direction and a separation direction of the substrate.
Inventors:
Hideki Nomoto
Axhiro Jun
Hitoshi Yonezawa
Axhiro Jun
Hitoshi Yonezawa
Application Number:
JP2008195729A
Publication Date:
January 06, 2010
Filing Date:
July 30, 2008
Export Citation:
Assignee:
Hitachi High-Technologies Corporation
International Classes:
H01L21/60; H05K3/32
Domestic Patent References:
| JP2003198197A | ||||
| JP10111483A | ||||
| JP2007057957A | ||||
| JP8107268A | ||||
| JP2009049238A | ||||
| JP2008242400A | ||||
| JP2006287011A | ||||
| JP2008153595A | ||||
| JP2008028132A |
Attorney, Agent or Firm:
Shunji Kagei
Kagei Keidai
Kagei Keidai