Title:
エポキシ樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP4395923
Kind Code:
B2
Inventors:
Norihisa Hoshika
Application Number:
JP17039499A
Publication Date:
January 13, 2010
Filing Date:
June 17, 1999
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/06; C08K3/00; C08G59/62; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
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| JP11067982A | ||||
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| JP11100490A | ||||
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| JP1230619A | ||||
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