Title:
封孔処理剤、封孔処理方法、及びその処理剤で処理されたプリント基板
Document Type and Number:
Japanese Patent JP4397376
Kind Code:
B2
Abstract:
A sealing agent and method of sealing, in which there is no problem of environmental pollution and anticorrosion performance equivalent or superior to that of the prior art can be realized by treatment therewith without detriment to solder wettability; and a printed circuit board having been treated with the sealing agent. There is provided a sealing agent comprising 0.001 to 0.1 wt.% in total of at least one member selected from among mercapto-having heterocyclic compounds and salts thereof and 0.01 to 1 wt.% of surfactant, which sealing agent is in the form of a solution having a pH value adjusted to 10 or below. Further, there are provided a method of sealing with the use of the sealing agent and a printed circuit board having been treated with the sealing agent.
Inventors:
Takashi Ouchi
Katsuyuki Tsuchida
Katsuyuki Tsuchida
Application Number:
JP2005517426A
Publication Date:
January 13, 2010
Filing Date:
January 21, 2005
Export Citation:
Assignee:
Nikko Metal Co., Ltd.
International Classes:
C25D5/48; C25D7/00; C25D7/12; H05K3/28
Domestic Patent References:
| JP10237687A | ||||
| JP2000282033A | ||||
| JP2000015743A | ||||
| JP2001181890A | ||||
| JP3215697A | ||||
| JP2003129257A | ||||
| JP7258887A | ||||
| JP8260193A | ||||
| JP2001279491A |
Attorney, Agent or Firm:
Masami Sakai
Norio Kagami
Jun Komatsu
Norio Kagami
Jun Komatsu